LX9200 is a 3D online automatic monitoring equipment, which is based on micron X-ray source, 3D/CT imaging, tomography and other technologies, using a closed microfocal X-ray source, coupled with high-definition FPD, to produce stable and high-quality X-rays, providing the basis for accurate detection
-Off line programming , realtime program modification
-In-line Automated X-Ray , inspection System
-Repair Station , barcode reading+realtime display
-Server , Database＆SPC＆MES
| Imaging system | |
| Imaging method | 2D, 2.5D, 3D (All in one) |
| X-ray source | Sealed tube (Max.130kv / 65w) |
| Detector | High resolution FPD (flat panel detector) |
| Image Resolution | 9um,12um,18um,24um,30um (option 3um or 6um) |
| Camera | CCD camera |
| Main Body | |
| Power supply voltage | 110-220V |
| Power supply frequency | 50/60HZ |
| Air pressure, capacity | 0.4~0.6Mpa |
| Dimensions | 1640mm(W) x 2070mm(D) x 1800mm(H) |
| Weight | 3710Kg |
| Motion | High speed smooth flying capture(High precision linear motor + linear encoder |
| CT mode | Planar CT |
| PCBA | |
| Conveyor height | 900±50mm |
| Inspection Area | 3D: 510mm X 670 mm ; 2D: 510mm X 730mm |
| Weight | max. 2kg (option:5kg) |
| Clearance | Top: 70mm ; Bottom : 40mm@30um |
| Application | |
| Inspection object | BGA, CSP, SOP, QFP, QFN, POP, inserted components, chips, T/H, Press-fit CN, IGBT, etc. |
| Inspection Items | Missing, misalignment, void, open, non-wet, shifting, foreign object, bridging, tombstone, insufficient / excess solder, solder ball, wrong polarity etc. |
